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AAT9060 Datasheet, PDF (2/6 Pages) Advanced Analogic Technologies – 30V N-Channel Power MOSFET
AAT9060
30V N-Channel Power MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol Description
DC Characteristics
BVDSS Drain-Source Breakdown Voltage
RDS(ON) Drain-Source ON-Resistance 3
ID(ON)
VGS(th)
IGSS
On-State Drain Current 3
Gate Threshold Voltage
Gate-Body Leakage Current
IDSS
Drain Source Leakage Current
gfs
Forward Transconductance 3
Dynamic Characteristics 4
QG
Total Gate Charge
QGT
Total Gate Charge
QGS
Gate-Source Charge
QGD
Gate-Drain Charge
tD(ON) Turn-ON Delay
tR
Turn-ON Rise Time
tD(OFF) Turn-OFF Delay
tF
Turn-OFF Fall Time
Source-Drain Diode Characteristics
VSD
Source-Drain Forward Voltage 3
IS
Continuous Diode Current 1
Notes:
Conditions
VGS=0V, ID=250µA
VGS=10V, ID=25A
VGS=4.5V, ID=19A
VGS=10V, VDS=5V (Pulsed)
VGS=VDS, ID=250µA
VGS=±20V, VDS=0V
VGS=0V, VDS=30V
VGS=0V, VDS=30V, TJ=70°C 4
VDS=5V, ID=9A
VDS=15V, RD=1.3Ω, VGS=5V
VDS=15V, RD=1.3Ω, VGS=10V
VDS=15V, RD=1.3Ω, VGS=10V
VDS=15V, RD=1.3Ω, VGS=10V
VDD=15V, RD=1.3Ω, VGS=10V, RG=6Ω
VDD=15V, RD=1.3Ω, VGS=10V, RG=6Ω
VDD=15V, RD=1.3Ω, VGS=10V, RG=6Ω
VDD=15V, RD=1.3Ω, VGS=10V, RG=6Ω
VGS=0, IS=20A
Min
30
60
1.0
Typ
13
21
20
13
25
4
3.5
12
38
21
32
Max Units
V
16
27
mΩ
A
V
±100 nA
1
25
µA
S
16
32
nC
ns
2
V
20
A
1. Based on thermal dissipation from junction to case. RθJC + RθCA = RθJA where the case thermal reference is defined as the solder
mounting surface of the drain tab. RθJC is guaranteed by design, however RθCA is determined by the PCB design. Package current is
limited to 30A DC and 60A pulsed.
2. Mounted on typical computer main board.
3. Pulse measurement 300 µs.
4. Guaranteed by design. Not subject to production testing.
2
9060.2003.05.0.9