CCS801 Datasheet, PDF (6/7 Pages) ams AG – Cambridge CMOS Sensors (CCS) micro-hotplate technology provides

DFN package outline
CC-000015-DS revision: 11
Datasheet for CCS801
ALL DIMENSIONS ARE IN MM
DESCRIPTION
TOTAL THICKNESS
STAND OFF
LEAD WIDTH
BODY SIZE
LEAD PITCH
EP SIZE
LEAD LENGTH
SYMBOL MIN
A
0.95
A1
0
b
0.7
D
E
e
J
1.06
K
1.3
L
0.25
L1
0.35
NOM
1.0
0.035
0.75
3 BSC
2 BSC
1.0 BSC
1.16
1.4
0.3
0.4
MAX
1.05
0.05
0.8
1.26
1.5
0.35
0.45
The recommended package footprint or landing pattern for CCS801 is shown below:
Pin 1 Corner
1
1.5
2
0.45
4 ^0.85
Note:
1. All dimensions are in mm
2. PCB land pattern in Green dash lines
3. Pin numbers are in Red
4. Add 0.05mm all around the nominal lead
width and length for the PCB land pattern
3 0.85
0.45
1.30
Top View
Page | 5
© Cambridge CMOS Sensors Ltd, Deanland House, Cowley Road, Cambridge, CB4 0DL, UK
Website: www.ccmoss.com
Telephone: [phone]
Date Issued: 26 May 2016