AS3953A Datasheet, PDF (6/42 Pages) ams AG – High Speed Passive Tag Interface

AS3953A
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Electrical Parameters
VDD
DC supply voltage
-0.5
5
V
VIN
Input pin voltage except LC1 and LC2
-0.5
5
V
Input pin voltage pins LC1 and LC2
-0.5
6.5
V
Peak current induced on pins
LC1 and LC2
100
mA
I_scr
Input current (latchup immunity)
-100
100
mA
Electrostatic Discharge
Comments
Norm: Jedec 78
ESD
Electrostatic discharge
±2
Temperature Ranges and Storage Conditions
kV
Norm: MIL 883 E method 3015
(Human Body Model)
T_strg
Storage temperature
-55
125
T_body
Package body temperature
260
Humidity non-condensing
Moisture Sensitivity Level for MLPD
MSL
Moisture Sensitivity Level for WL-CSP
t_{strg_DOF}
T_{strg_DOF}
Storage time for DOF/dies or wafers on foil
Storage temperature for DOF/dies or
wafers on foil
RH_{open_DOF}
Relative humidity for DOF/dies or wafers on
foil in open package
RH_{Unopen_DOF}
Relative humidity for DOF/dies or wafers on
foil in closed package
5
85
3
1
3
18
24
15
40
60
ºC
Norm: IPC/JEDEC J-STD-020
The reflow peak soldering temperature
(body temperature) is specified
according IPC/JEDEC J-STD-020
ºC
“Moisture/Reflow Sensitivity
Classification for Non-hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded
packages is “Matte Tin” (100% Sn)
%
months
ºC
%
%
Refer to indicated date of packing
Opened package
Unopened package
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