TCS3404_11 Datasheet, PDF (39/41 Pages) ams AG – DIGITAL COLOR SENSORS

TCS3404, TCS3414
DIGITAL COLOR SENSORS
TAOS137A − APRIL 2011
MANUFACTURING INFORMATION
The CS and FN packages have been tested and has demonstrated an ability to be reflow soldered to a PCB
substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 12. Solder Reflow Profile
lid ^PARAMETER
Average temperature gradient in preheating
Soak time
a ^{Time above 217°C (T1)}
Time above 230°C (T2)
v _{Time above Tpeak −10°C (T3)}
Peak temperature in reflow
ill ^{Temperature gradient in cooling}
REFERENCE
t_soak
t₁
t₂
t₃
T_peak
TCS3404/14
2.5°C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260° C (−0°C/+5°C)
Max −5°C/sec
t _Tpeak
G _s ^T3
A ^{t T2}
s ^{n T1}
Not to scale — for reference only
Technicaaml ^{conte Time(sec)}
t₃
t₂
t_soak
t₁
Figure 35. Solder Reflow Profile Graph
Copyright E 2011, TAOS Inc.
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