TCS3404_11 Datasheet, PDF (35/41 Pages) ams AG – DIGITAL COLOR SENSORS

TCS3404, TCS3414
DIGITAL COLOR SENSORS
TAOS137A − APRIL 2011
MECHANICAL DATA
PACKAGE CS
Six-Lead Chipscale
TOP VIEW
2095
PINOUT
TOP VIEW
SCL SYNC GND
A1 A2 A3
lid ₁₅₆₅
+ 10
1875
G _still ^va _{END VIEW}
A ^t _{685 + 45}
350
+ 10
PHOTODIODE ARRAY
405 + 20
ms ^{ten 6 y 160 + 30}
a ⁿ _{BOTTOM VIEW}
o _{CL of Photodiode}
c ^{Array Area}
l _{463 + 30}
CL ^{of Solder Bumps}
128 Nominal
6 y j 300 + 30
ica ⁹⁵⁰
Nominal
CL of Solder Bumps and
Photodiode Array Area
B1 B2 B3
SDA V_DD INT
hn _{438 + 30}
610 Nominal
c _{NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted.}
e _{B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).}
C. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.
T^{D. This drawing is subject to change without notice.}
Pb
Lead Free
Figure 31. Package CS — Six-Lead Chipscale Packaging Configuration
Copyright E 2011, TAOS Inc.
r
The LUMENOLOGY r Company
r
34
www.taosinc.com