TCS3490 Datasheet, PDF (27/34 Pages) ams AG – Color Light-to-Digital Converter

TCS3490 − Soldering & Storage Information
Soldering & Storage
Information
Figure 37:
Solder Reflow Profile
The FN package has been tested and has demonstrated an
ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Parameter
Average temperature gradient in preheating
Soak time
Time above 217 ºC (T₁)
Time above 230 ºC (T₂)
Time above T_peak - 10 ºC (T₃)
Peak temperature in reflow
Temperature gradient in cooling
Reference
t_soak
t₁
t₂
t₃
T_peak
Device
2.5 ºC/s
2 to 3 minutes
Max 60 s
Max 50 s
Max 10 s
260 ºC
Max -5 ºC/s
Figure 38:
Solder Reflow Profile Graph
T_peak
T₃
T₂
T₁
NottoScale
Timeinseconds
ams Datasheet
[v1-09] 2016-Jan-11
t₃
t₂
Page 27
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