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| TMD2620 Datasheet, PDF (26/33 Pages) ams AG – The device is an advanced proximity sensor | |||
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TMD2620 â Soldering&StorageInformation
Soldering & Storage
Information
Figure 37:
Solder Reflow Profile
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Parameter
Average temperature gradient in preheating
Soak time
Time above 217°C (T1)
Time above 230°C (T2)
Time above Tpeak â 10 °C (T3)
Peak temperature in reflow
Temperature gradient in cooling
Reference
tsoak
t1
t2
t3
Tpeak
Device
2.5°C/s
2 to 3 minutes
Max 60 s
Max 50 s
Max 10 s
260°C
Max â5°C/s
Figure 38:
Solder Reflow Profile Graph
Tpeak
T3
T2
T1
NottoScale
Timeinseconds
Page 26
Document Feedback
t3
t2
ams Datasheet
[v1-01] 2016-Aug-02
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