IAQ-CORE Datasheet, PDF (12/22 Pages) ams AG – The iAQ-Core sensor module is used to measure VOC levels

Application Information
Figure 20:
Reflow Soldering Profile
iAQ-Core − ApplicationInformation
Handling Instructions
The iAQ-Core module should be handled carefully, shear stress
should be avoided. The sensor is protected by a membrane. This
membrane should not be removed or touched.
Soldering Instructions
For soldering the iAQ-Core sensor module, standard reflow
soldering ovens could be used. The reflow ovens shall be
purged with clean air. Other gases must be avoided. For the lead
free reflow process a standard process IPC/JEDEC J-STD-020
with peak temperature up to max 230°C is suggested. See
Figure 20 for more detailed description.
Note(s): The device shall be kept clear of liquids; therefore a
PCB washing process must be avoided in any case.
For manual soldering, contact time must be limited to 5 seconds
at a maximum temperature of 350°C.
Reflow Soldering Profile: Ts min = 150°C; Ts max = 200°C; Ts Preheat = 60-120sec; TL < 220°C for < 150sec;
TP ≤ 230°C for < 30sec; Ramp-up/down speed shall be < 5°C/sec.
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ams Datasheet
[v1-00] 2015-Apr-30