PLCC Datasheet, PDF (2/2 Pages) Amkor Technology – Amkor’s PLCC IC package portfolio provides

data sheet
Cross-section PLCC
LEADFRAME
PLCC
Process Highlights
Die thickness (max) 25 mils
Strip solder plating 85/15 Sn/Pb or
100% Sn
Strip marking
Laser/pad/offset
Lead inspection
Optical
Pack/ship options
Bar code
Test Services
• Program/generation/conversion
• Product engineering
• Wafer sort
• 256 pin x 20 MHz test system available
• -55 °C to +165 °C test available
• Burn-in
Shipping
Clear antistatic tube 20 inches
Configuration Options:
PLCC NOMINAL PACKAGE DIMENSIONS
Lead Count
Square
20
28
44
52
68
84
Rectangular
32
Body Size
.352 x .352
.452 x .452
.652 x .652
.752 x .752
.952 x .952
1.152 x 1.152
.452 x .552
Body
Thickness
0.152
0.152
0.152
0.152
0.150
0.150
0.109
Lead Pitch Lead Form
0.05
N/A
0.05
N/A
0.05
N/A
0.05
N/A
0.05
N/A
0.05
N/A
0.05
N/A
Amkor
Dwg No.
00060
00060
00060
00060
00060
00060
00061
JEDEC
Dwg No.
MS-018
MS-018
MS-018
MS-018
MS-018
MS-018
MS-016
Qty Per
Tube
46
37
26
23
18
15
30
w w w. a m ko r. c o m
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.