PLCC Datasheet, PDF (1/2 Pages) Amkor Technology – Amkor’s PLCC IC package portfolio provides

data sheet
LEADFRAME
Plastic Leaded Chip
Carrier (PLCC)
Packages:
Amkor’s PLCC offerings cover the total
range offered by the industry. It includes all
square body packages from 20 lead through
84 lead. Also included is the rectangular
body format of the 32 lead. All PLCC
products are offered with and without
heatspreaders. The heatspreader versions
are identical in form factor to the standard
non-heatspreader versions. Both versions
are JEDEC compliant in all respects. The
heatspreader versions give the system
designer greater latitude in thermally
enhanced board level and/or system design.
All products utilize the most advanced
manufacturing equipment offered today.
Lead free and green material set are
qualified.
Applications:
Amkor’s PLCC product family was engi-
neered to meet JEDEC requirements for “J”
leaded surface mount packages. As such,
they take up less board space than equiva-
lent “gull” formed product in the same body
size. Due to the flexibility and performance
offered, most industry circuit types can be
designed into this product. This would
include memory, processors and controllers,
ASIC, DSP, PC chipset, to name a few.
Applications range from consumer through
automotive and aerospace.
Features:
PLCC
Amkor’s PLCC IC package portfolio provides:
• .352” x .352” to 1.152” x 1.152” body size
• 20 to 84 lead counts
• JEDEC standard compliant
• Available with heatspreader option
• Fine pitch wire bond capability
Thermal Resistance:
Electrical:
Reliability:
Multi-Layer PCB
Body Size
Pad Size
Pkg
(mm)
(mm)
44 ld
16.6 x 16.6
7.8 x 7.8
44 ld*
16.6 x 16.6
7.8 x 7.8
*With Drop-in heatspreader option
Theta JA (°C/W) by Velocity
0
200 500
30.0 24.5 22.0
24.4 19.0 16.6
Tested @ 1W
Body Size Pad Size
Self
Bulk
Self
Inductance Capacitance Resistance
Pkg (mm) (mm) Lead (nH)
(pF)
(mΩ)
20 ld 8.9 x 8.9 220 x 220 Longest 2.110 0.596
13.5
Shortest 1.780 0.583
11.1
Simulated Results @ 100 MHz
Amkor’s PLCCs are reliability assured through optimized design,
material and process enabling high performance operation of your
IC chip.
• Moisture sensitivity
characterization
JEDEC Level 3
30 °C/60% - 192 hrs, SAT-192 hrs
• PCT
121 °C, 2 atm, 100%RH, 504 hours
• Temp cycle
-65/150 °C, 1000 cycles
• Temp/Humidity
85 °C/85% RH, 1000 hours
• High temp storage
150 °C, 1000 hours
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
w w w. a m ko r. c o m
DS293D
Rev Date: 07’03