PBGA Datasheet, PDF (2/2 Pages) Amkor Technology – Innovative designs and expanding package offerings provide a platform from prototype-to-production

data sheet
L A M I N AT E
PBGA Cross Section
PBGA
Process Highlights
Die thickness (max)
13 mils
Bond pad pitch (min)
2.4 mils
Marking
Laser
Ball inspection
Optical
Pack / Ship options
JEDEC trays, Dry pack
Wafer backgrinding
Available
PBGA Standard Package Offering (mm)
BODY
SIZE
BALL
COUNT
13.0 x 13.0 144
14.0 x 22.0 119
153
15.0 x 15.0 121
156/160
196
17.0 x 17.0 192/208
256
19.0 x 19.0 240
289
324
23.0 x 23.0 169
208/217
240/249
289
288/324
484
27.0 x 27.0 225
256/272
300/316
356
400
416
676
31.0 x 31.0 304/329
360/385
529
516
900
35.0 x 35.0 313
352/388
420/456
452
809
580
680
1,156
37.5 x 37.5 524
784
40.0 x 40.0 564
900
BALL
PITCH
1.0
1.27
1.27
1.27
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.50
1.27
1.27
1.27
1.00
1.00
1.50
1.27
1.27
1.27
1.27
1.00
1.00
1.27
1.27
1.27
1.00
1.00
1.27
1.27
1.27
1.27
1.27
1.00
1.00
1.00
1.27
1.27
1.27
1.27
BALL BALL
MATRIX DIAM.
12 x 12 F 0.51
7 x 17 F 0.76
9 x 17 F 0.76
11 x 11 F 0.76
14 x 14 P 0.51
14 x 14 F 0.51
16 x 16 P 0.51
16 x 16 F 0.51
18 x 18 P 0.51
17 x 17 P 0.51
18 x 18 P 0.51
13 x 13 F 0.76
17 x 17 P 0.76
17 x 17 P 0.76
17 x 17 F 0.76
22 x 22 P 0.63
22 x 22 F 0.63
15 x 15 F 0.76
20 x 20 P 0.76
20 x 20 P 0.76
20 x 20 P 0.76
20 x 20 F 0.76
26 x 26 P 0.63
26 x 26 F 0.63
23 x 23 P 0.76
23 x 23 P 0.76
23 x 23 F 0.76
30 x 30 P 0.63
30 x 30 F 0.63
25 x 25 S 0.76
26 x 26 P 0.76
26 x 26 P 0.76
26 x 26 P 0.76
26 x 26 F 0.76
34 x 34 P 0.63
34 x 34 P 0.63
34 x 34 F 0.63
28 x 28 P 0.76
28 x 28 F 0.76
30 x 30 P 0.76
30 x 30 F 0.76
PCB THICKNESS
2 LYR
4 LYR
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.32
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
0.52
0.56
MOLD
CAP
THK
0.80
0.90
0.90
1.17
0.80
0.80
0.80
0.80
0.80
0.80
0.80
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
TOTAL PACKAGE
THICKNESS
2 LYR 4LYR
1.52 1.76
1.82 2.06
1.82 2.06
2.09 2.33
1.52 1.76
1.52 1.76
1.52 1.76
1.52 1.76
1.52 1.76
1.52 1.76
1.52 1.76
2.09 2.33
2.09 2.33
2.09 2.33
2.09 2.33
1.99 2.23
1.99 2.23
2.09 2.33
2.09 2.33
2.09 2.33
2.09 2.33
2.09 2.33
1.99 2.23
1.99 2.23
2.29 2.33
2.29 2.33
2.29 2.33
2.19 2.23
2.19 2.23
2.29 2.33
2.29 2.33
2.29 2.33
2.29 2.33
2.29 2.33
2.19 2.23
2.19 2.23
2.19 2.23
2.29 2.33
2.29 2.33
2.29 2.33
2.29 2.33
w w w. a m ko r. c o m
Standard Materials
Package Substrate:
CCL-HL832
Die attach:
Ablestik 2300
Au wire:
25 µm or 30 µm
Mold compound:
Nitto GE 100L
Solder balls:
63 Sn / 37 Pb
Test Services
Program generation/conversion
Product engineering
Wafer sort
256 Pin x 20 MHz test system available
-55 °C to + 125 °C test available
Tape and Reel services
Burn-in
Shipping
Low profile tray (JEDEC Outline CO-029)
NOTE: All measurements in mm.
P = Perimeter F = Full Array S = Stagger
= Maximum possible ball count (may not be
tooled). Additional depopulated options
are available. Contact account manager
for additional tooling.
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.