PBGA Datasheet, PDF (1/2 Pages) Amkor Technology – Innovative designs and expanding package offerings provide a platform from prototype-to-production

data sheet
L A M I N AT E
Plastic Ball Grid Array
(PBGA):
Amkor’s PBGAs incorporate the most advanced
assembly processes and designs for today’s and
tomorrow’s cost/performance applications. This
advanced IC package technology allows application
and design engineers to optimize innovations
while maximizing the performance characteristics
of semiconductors. Amkor’s PBGAs are designed
for low inductance, improved thermal operation
and enhanced SMT ability. Custom performance
enhancements, like ground and power planes, are
available for significant improvements in electrical
response demanded by advancing electronics.
Additionally, these PBGAs utilize industry proven,
semiconductor grade materials for reliable, long-
term operations while providing the user flexible
design parameters.
Applications:
Semiconductor technologies find enhanced
performance by using the integrated design
features of Amkor’s PBGAs. Microprocessors /
controllers, ASICs, Gate Arrays, memory, DSPs,
PLDs, graphics and PC chip sets find Amkor’s
PBGA family to be an ideal package. Applications
requiring improved portability, form-factor/size
and high-performance such as cellular, wireless
telecommunications, PCMCIA cards, global posi-
tioning systems (GPS), laptop PC's, video cameras,
disc drives, PLDs, graphics and other similar
products benefit from Amkor's PBGA attributes.
PBGA
Features:
Innovative designs and expanding package offerings provide
a platform from prototype-to-production.
• Custom ball counts up to 1521
• 1.00, 1.27 & 1.50 mm ball pitch available
• 13 mm to 40 mm body sizes
• Low Profile and lightweight
• Thermal and electrical enhancement capable
• Highly flexible internal routing of signal, power and ground
for device performance and system compatibility
• HDI designs possible
• Suitable substrate for multi-die and integrated SMT structures
• Mature strip based manufacturing process with high yields
• Full in-house design capability
• Quickest design-to-prototype delivery
• Perimeter, stagger and full ball arrays
• Special packaging for memory available
• Multi-layer, ground / power
• JEDEC MS-034 standard outlines
• Excellent reliability
• 63 Sn / 37 Pb Eutectic solder balls
Thermal Resistance:
Multi layer PCB, 0 air flow
PCB Cu Theta JA
Pkg Body Size Layer Thickness (°C/W)
272
27.0 x 27.0 2
N/A
22
388
35.0 x 35.0 2
N/A
19
272
27.0 x 27.0 4 36 µm
19
388
35.0 x 35.0 4 36 µm
16
356* TE 27.0 x 27.0 4 72 µm
16
452* TE 35.0 x 35.0 4 72 µm
14
356**TE-2 27.0 x 27.0 4
72 µm
13.5
452**TE-2 35.0 x 35.0 4 72 µm
12
*TEPBGA **TEPBGA-2
Results dependent on body size, die size, and PCB design.
Reliability:
Amkor assures you reliable performance by continuously
monitoring key indices:
• Moisture sensitivity
characterization
• High temp op life
• Autoclave or unbiased hast
• High temp storage
• Temp cycle
JEDEC Level 3
30 °C/60% RH/192 hours
125 °C, 6V, 1000 hours
130 °C/85% RH/96 hours
150 °C, 1000 hours
-55/+125 °C, 1000 cycles
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION .
w w w. a m ko r. c o m
DS 520L
Rev Date: 05’07