LQFP Datasheet, PDF (2/2 Pages) STATS ChipPAC, Ltd. – Low Profile Quad Flat Pack

data sheet
LEADFRAME
Cross-section LQFP
Leadframe
Mold
Die Attach ^Compound
Adhesive
Gold Wire
LQFP
Process Highlights
Die thickness
14.5 ± .5 mil
Strip solder plating 85/15 Sn/Pb
Marking
Laser
Lead inspection
Laser/optical
Pack/ship options
Bar code, dry pack
Wafer backgrinding Available
Die Attach Pad
Test Services
• Program generation/conversion
• Product engineering
• Wafer sort
• 256 Pin x 20 MHz test system available
• -55 °C to +165 °C test available
• Burn-in
Shipping
JEDEC outline CO-124 low profile tray
Configuration Options:
LQFP Nominal Package Dimensions (units in mm)
Body Body Lead
Foot
Size Tkns Form Standoff Length Tip To Tip
Lead Count
JEDEC
7 x 7 1.40 1.00 0.10 0.60
9.0
32/48/64
MS-026
10 x 10 1.40 1.00 0.10 0.60
12.0
44/52/64/80
MS-026
14 x 14 1.40 1.00 0.10 0.60
16.0 44/64/80/100/120/128 MS-026
14 x 20 1.40 1.00 0.10 0.60 16.0 x 22.0
100/128
MS-026
20 x 20 1.40 1.00 0.10 0.60
22.0
128/144/176
MS-026
24 x 24 1.40 1.00 0.10 0.60
26.0
160/176/216
MS-026
28 x 28 1.40 1.00 0.10 0.60
30.0
160/208/256
MS-026
Tray
Matrix
10 x 25
8 x 20
6 x 15
6 x 12
5 x 12
4 x 10
4x9
Units
Per Tray
250
160
90
72
60
40
36
w w w. a m ko r. c o m
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.