LQFP Datasheet, PDF (1/2 Pages) STATS ChipPAC, Ltd. – Low Profile Quad Flat Pack

data sheet
LEADFRAME
LQFP
Features:
Amkor’s LQFP packaging portfolio provides:
• 7 x 7 mm to 28 x 28 mm body size • 32 to 256 lead counts
• Copper leadframes
• Broad selection of die pad sizes
• Custom leadframe design available
• 1.4 mm body thickness
• Low stress die attach adhesive
• Rapid cure mold compound
• Power enhancement version - PowerQuad^
Low Profile Quad Flat
Pack (LQFP) Packages:
Amkor offers a broad line of LQFP IC packages
designed to provide the same great benefits
as MQFP packaging with a 1.4 mm body
thickness. This allows IC packaging engineers,
component specifiers and systems designers
to solve issues such as increasing board
density, die shrink programs, thin end-product
profile and portability.
Applications:
Amkor’s LQFPs are an ideal IC package for
most IC semiconductor technologies such as
ASIC, DSP, controllers, processors, gate arrays
(FPGA/PLD), SRAMs and PC chip sets.
LQFPs are particularly suited for light weight,
portable electronics requiring broad perform-
ance characteristics. Such applications are lap-
top PCs, video/audio, telecom, cordless/RF,
data acquisition, office equipment, disc-drives
and communication boards.
Thermal Resistance:
Single-Layer PCB
Pkg
32 ld
100 ld
100 ld
144 ld
176 ld
Body Size (mm)
7x7
14 x 14
14 x 20
20 x 20
24 x 24
Pad Size (mm)
5x5
8x8
9.5 x 9.5
8.5 x 8.5
8x8
Theta JA (°C/W) by Velocity (LFPM)
0
200
500
67.8 55.9 50.1
41.5 33.4 29.5
39.7 31.8 28.3
38.0 31.2 28.1
38.3 31.9 29.0
JEDEC Standard Test Boards
Multi-Layer PCB
Pkg
32 ld
100 ld
100 ld
144 ld
176 ld
208 ld*
Body Size (mm) Pad Size (mm)
7x7
5x5
14 x 14
8x8
14 x 20 9.5 x 9.5
20 x 20 8.5 x 8.5
24 x 24
8x8
28 x 28
16 x 16
Theta JA (°C/W) by Velocity (LFPM)
0
200 500
47.9 42.1 39.4
31.7 26.8 24.7
30.0 25.1 23.0
31.7 26.9 24.9
31.9 27.3 25.4
18.1 15.3 14.4
*Pre-JEDEC Standard Test Boards
All others - JEDEC Standard Test Boards
Tested @ 1 W
Electrical:
Body Size PadSize
Pkg
(mm) (mm)
32 ld 7 x 7 5 x 5
48 ld 7 x 7 5 x 5
100 ld 14 x 14 8 x 8
144 ld 20 x 20 8.5 x 8.5
176 ld 24 x 24 8 x 8
208 ld 28 x 28 11 x 11
Simulated Results @ 100 MHz
Inductance Capacitance Resistance
Lead (nH) (pF) (mΩ)
Longest 0.904 0.211 9.2
Shortest 0.799 0.202 7.8
Longest 1.110 0.225 13.8
Shortest 0.962 0.200 12.0
Longest 2.300 0.419 26.3
Shortest 1.520 0.322 17.8
Longest 6.430 1.100 62.9
Shortest 4.230 1.070 52.6
Longest 9.510 1.270 89.0
Shortest 5.200 1.340 64.0
Longest 9.670 1.380 86.2
Shortest 6.190 1.210 64.8
Reliability:
IC chips are assembled in optimized package designs with proven reliable
semiconductor materials.
• Moisture sensitivity
characterization
• PCT
• Temp cycle
• Temp/humidity
• High temp storage
JEDEC Level 3
30 °C/60%RH, 192 hrs
121 °C, 100%RH, 2 atm, 504 hours
-55/+125 ° C, 1000 cycles
85 °C/85% RH, 1000 hours
150 °C, 1000 hours
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
w w w. a m ko r. c o m
DS232B
Rev Date: 08’00