AMIS-722402 Datasheet, PDF (4/15 Pages) AMI SEMICONDUCTOR – Contact Image Sensor

AMIS-722402: Contact Image Sensor
Data Sheet
4.2 Bonding Pad Layout Diagram
Figure 2 shows the bonding pad locations for the AMIS-722402 sensor.
14560µm
SI GBST CLK
SIC
WS
VOUT
VREF VSS VDD VBIAS SR1 SR2
SO
230µm
Pad Location Table
Pad
Location
Y
SI
Start Pulse
20
GBST Global Start Pulse
20
CLK Clock
20
SIC Start Input Control
20
WS Waveform Select
20
VOUT Video Output Voltage
20
VREF Reference Voltage
20
VSS Ground
20
VDD Power Supply
20
VBIAS _{Chip Bias Voltage}
20
SR1 _{Select Resolution 1}
20
SR2 _{Select Resolution 2}
20
SO End of Scan Pulse
20
X
2127
2379
2633
2890
3826
4077
6084
6428
7393
10960
11214
11468
12103
Notes:
1. The drawing is not to scale.
2. The die length and width are given
in the above sensor die figure
3. Pad locations are listed in the Pad Location Table
eg. Y
SI GBST
X
X
4. Each pad is 100 x 70um
5. All dimensions are in um
6. Die size does not include the scribe line
Figure 2: AMIS-722402 Bonding Pad Layout
AMI Semiconductor – Jan. 06, M-20499-004
4
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