AMIS-720658 Datasheet, PDF (4/15 Pages) AMI SEMICONDUCTOR – Contact Image Sensor

AMIS-720658: Contact Image Sensor
Data Sheet
4.2 Bonding Pad Layout Diagram
Figure 2 shows the bonding pad locations for the AMIS-720658 sensor.
14560µm
2290µm
SI GBST CLK
SIC
SR
VDD
VOUT
VSS
VREF
Pad Location Table
Pad
Location
SI
GBST
CLK
SIC
SR
VDD
VOUT
VSS
VREF
SO
Start Pulse
Global Start Pulse
Clock
Start Input Control
Select Resolution
Power Supply
Video Output Voltage
Ground
Reference Voltage
End of Scan Pulse
Y
X
30.0 _2290.0
30.0 _2637.0
30.0 _3649.0
30.0 _3929.0
30.0 _4243.0
34.0 _4850.0
30.0 _5135.0
34.0 _9498.0
30.0 _9844.0
30.0 12190.0
Notes:
1. Definition of X and Y Pad Locations
Y
SI GBST
X
X
2. Each pad is 80um x 70um
3. All dimensions are in um
4. Die size does not include the scribe line
2370µm
335µm
SO
Figure 2: AMIS-720658 Bonding Pad Layout
AMI Semiconductor – Jul 06, M-20503-007
4
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