AMIS-720341 Datasheet, PDF (2/16 Pages) AMI SEMICONDUCTOR – Contact Image Sensor

AMIS-720341-A: Contact Image Sensor
Data Sheet
2.0 Bonding Pad Outputs Locations and Die Dimensions
Figure 2 shows the die dimensions of the image sensor and the bonding pad locations for the AMIS-720341-A sensor chip. The location
is referenced to the lower left corner of the die.
Figure 2: Bonding Pad and Chip Layout
AMI Semiconductor – May 06, M-20570-001
2
www.amis.com