AMIS-30663 Datasheet, PDF(12/12 Page) AMI SEMICONDUCTOR

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AMIS-30663 High Speed CAN Transceiver

Data Sheet

Table 8: Soldering Process

Package

BGA, SQFP

HLQFP, HSQFP, HSOP, HTSSOP, SMS

PLCC (3), SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO

Soldering Method

Wave

Reflow (1)

Not suitable

Suitable

Not suitable (2)

Suitable

Not recommended (3)(4) Suitable

Not recommended (5) Suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package,

there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the drypack information

in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods."

2. These packages are not suitable for wave soldering as a solder joint between the printed circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick

to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45Â° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream

and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal to or

smaller than 0.65mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or

smaller than 0.5mm.

AMI Semiconductor - Rev. 1.4, Oct. 04

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