AMIS-30663 Datasheet, PDF (10/12 Pages) AMI SEMICONDUCTOR – High Speed CAN Transceiver

AMIS-30663 High Speed CAN Transceiver
9.0 Package Outline
SOIC-8: Plastic small outline; 8 leads; body width 150 mil; JEDEC: MS-012
Data Sheet
Symbol
A
A1
A2
B
C
D
E
e
H
h
L
N
a°
Note
AA
AB
AC
Common Dimensions
Min. Nom. Max.
.061
.064
.068
.004
.006 0.010
.055
.058
.061
.0138 .061
.020
.0075 .008 .0098
See Variations
.150
.155
.157
.050 BSC
.230
.236
.244
.010
.013
.016
.016
.025
.035
See Variations
0°
5°
8°
Variations
1
D
Min. Nom. Max.
.189
.194
.196
.337
.342
.344
.386
.391
.393
Note
1
2
2
N
8
14
16
NOTES:
1. Maximum die thickness allowable is .015.
2. Dimensioning and tolerances per ANSI.Y14.5M - 1982.
3. “L” is the length of terminal for soldering to a substrate.
4. “N” is the number of terminal positions.
5. Formed leads shall be planar with respect to one another
within .003 inches at seating plane.
6. Country of origin location and ejector pin on package
bottom is optional and depend on assembly location.
7. Controlling dimension: inches.
AMI Semiconductor - Rev. 1.4, Oct. 04
10
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