N04L1630C2B Datasheet, PDF (11/12 Pages) AMI SEMICONDUCTOR – 4Mb Ultra-Low Power Asynchronous CMOS SRAMs 256K × 16 bit POWER SAVER TECHNOLOGY TM

AMI Semiconductor, Inc.
N04L1630C2B
Advance Information
Ball Grid Array Package
D
A1 BALL PAD
CORNER (3)
0.28±0.05
1.24±0.10
E
1. 0.35±0.05 DIA.
K TYP
TOP VIEW
SIDE VIEW
2. SEATING PLANE - Z
0.15 Z
0.05 Z
SD
A1 BALL PAD
1. DIMENSION IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER.
CORNER
PARALLEL TO PRIMARY Z.
2. PRIMARY DATUM Z AND SEATING
PLANE ARE DEFINED BY THE
e
SPHERICAL CROWNS OF THE
SOLDER BALLS.
SE
3. A1 BALL PAD CORNER I.D. TO BE
MARKED BY INK.
J TYP
e
BOTTOM VIEW
(DOC# 14-02-042 ReI I ECN# 01-1374
The specifications of this device are subject to change without notice. For latest documentation see http://www.amis.com.