PI3012A Datasheet, PDF (1/7 Pages) AMI SEMICONDUCTOR – 300DPI CIS Sensor Chip

™ _Peripheral
Imaging
Corporation
PI3012A
300DPI CIS Sensor Chip
Engineering Data Sheet
Description:
Peripheral Imaging Corporation PI3012A CIS sensor chip is a 300 dot per inch resolution
linear array image sensor chip which utilizes PIC’s proprietary CMOS Image Sensing
Technology. This image sensor is to be used for butting end-to-end on a printed circuit board
(PCB) using chip-on-board technology to form a scanning array with various lengths.
Applications for the sensor array are facsimile, scanner, check reader, and office automation
equipment.
Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 96 detector elements,
8080µm
1
23
4 ROW OF 96 SENSORS 93 94 95 96
AND VIDEO SIGNAL
LINE MULTIPLEXER
READOUT SHIFT REGISTER
380µm
BUFFER
SP
BUFFER
CP VDD DGND
CHIP
SELECT
IOUT
PI3012A SENSOR CHIP
FIGURE 1 BLOCK DIAGRAM
BUFFER
EOS
their associated multiplexing switches, buffers, and a chip selector. The detector element-to-element
spacing is approximately 84.6 µm. The size of each chip without scribe lines is 8080 µm by 380 µm.
Each sensor chip has 6 bonding pads. The pad symbols and functions are described in Table 1.
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