AME8800_08 Datasheet, PDF (22/36 Pages) Analog Microelectronics – 300mA CMOS LDO

AME
AME8800 / 8811
300mA CMOS LDO
n Thermal Information
Parameter
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Internal Power Dissiption
Package
SOT-23
SOT-25
SOT-89
TO-92
SOT-23**
SOT-25**
SOT-89*
TO-92**
SOT-23
SOT-25
SOT-89
TO-92
Maximum Junction Temperature
Solder Iron (10 Sec)***
Die Attach
Non-Conductive
Epoxy
Non-Conductive
Epoxy
Conductive Epoxy
Non-Conductive
Epoxy
Conductive Epoxy
Non-Conductive
Epoxy
Non-Conductive
Epoxy
Non-Conductive
Epoxy
Conductive Epoxy
Non-Conductive
Epoxy
Conductive Epoxy
Non-Conductive
Epoxy
Non-Conductive
Epoxy
Non-Conductive
Epoxy
Conductive Epoxy
Non-Conductive
Epoxy
Conductive Epoxy
Non-Conductive
Epoxy
Symbol
θ_JA
θ_JC
P_D
* Measure θ_JC on backside center of tab.
** Measure θ_JC on center of molding compound if IC has no tab.
*** MIL-STD-202G 210F
Maximum
280
280
180
180
150
150
140
140
40
46
80
80
400
400
550
550
625
625
150
350
Unit
o_{C / W}
mW
o_C
o_C
22
Rev.T.05