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| AM49DL640BG Datasheet, PDF (8/62 Pages) SPANSION – Stacked Multi-Chip Package (MCP) Flash Memory and SRAM | |||
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CONNECTION DIAGRAM
PRELIMINARY
73-Ball FBGA
Top View
A1
A10
NC
NC
B1
B5 B6
B10
NC
NC NC
NC
C1
C3 C4 C5 C6 C7 C8
NC
A7
LB# WP#/ACC WE# A8 A11
D2 D3 D4 D5 D6 D7 D8 D9
A3
A6 UB# RESET# CE2s A19 A12 A15
E2 E3 E4 E5 E6 E7 E8 E9
A2
A5 A18 RY/BY# A20 A9 A13 A21
F1 F2 F3 F4
F7 F8 F9 F10
NC
A1
A4 A17
G1 G2 G3 G4
A10 A14 NC NC
G7 G8 G9 G10
NC
A0
VSS DQ1
DQ6 NC A16 NC
H2 H3 H4 H5 H6 H7 H8 H9
CE#f OE# DQ9 DQ3 DQ4 DQ13 DQ15/A-1 CIOf
J2 J3 J4 J5 J6 J7 J8 J9
CE1#s DQ0 DQ10 VCCf VCCs DQ12 DQ7 VSS
K3 K4 K5 K6 K7 K8
DQ8 DQ2 DQ11 NC DQ5 DQ14
L1
L5 L6
L10
NC
NC NC
NC
M1
M10
NC
NC
Flash only
Pseudo
SRAM only
Shared
Special Package Handling Instructions
Special handling is required for Flash Memory products
in molded packages (TSOP, SO, PDIP, PLCC). The
package and/or data integrity may be compromised if
the package body is exposed to temperatures above
150°C for prolonged periods of time.
March 8, 2002
Am49DL640BG
7
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