AM30LV0064D Datasheet, PDF (8/41 Pages) Advanced Micro Devices – 64 Megabit (8 M x 8-Bit) CMOS 3.0 Volt-only Flash Memory with UltraNAND Technology

CONNECTION DIAGRAMS (Continued)
40-Ball FBGA
Top View, Balls Facing Down
0.8 A B C D E F G H J K
NC VCC NC NC NC NC NC NC VCCQ NC
6
0.8
NC CE# RE# RY/BY# SE# IO7 IO6 IO5 IO4 NC _0.8
5
4
1.6
3
NC CLE ALE WE# WP# IO0 IO1 IO2 IO3 NC
2
NC VSS NC NC RFU NC NC NC VSS NC 0.8
1
0.8
Ø0.400 mm 0.250 SMD, Ball = 0.3 mm
15 mm
Note: The ball grid array is depopulated to 40 signal balls. The maximum package height is 1.2 mm. The 9 x 9 x 9 x 9 outrigger
balls (shaded) may be required for higher density devices in larger packages. The shaded ball region should be treated as a
“keep out” area with pads placed to allow larger devices to be accommodated.
Special Handling Instructions
Special handling is required for Flash Memory prod-
ucts in FBGA packages.
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compro-
mised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
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Am30LV0064D