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DS42585 Datasheet, PDF (34/58 Pages) Advanced Micro Devices – Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
PRELIMINARY
DC CHARACTERISTICS (Continued)
CMOS Compatible
Parameter
Symbol
Parameter Description
Test Conditions
Min
Typ
Max
Unit
Voltage for WP#/ACC Program
VHH Acceleration and Sector
Protection/Unprotection
8.5
9.5
V
Voltage for Sector Protection,
VID
Autoselect and Temporary Sector
Unprotect
8.5
12.5
V
VOL
Output Low Voltage
VOH1
VOH2
VLKO
Output High Voltage
Flash Low VCC Lock-Out Voltage
(Note 5)
IOL = 4.0 mA, VCCf = VCCs =
VCC min
IOH = –2.0 mA, VCCf = VCCs =
VCC min
IOH = –100 µA, VCC = VCC min
0.85 x
VCC
VCC–0.4
2.3
0.45
V
V
2.5
V
Notes:
1. The ICC current listed is typically less than 2 mA/MHz, with OE# at VIH.
2. Maximum ICC specifications are tested with VCC = VCCmax.
3. ICC active while Embedded Erase or Embedded Program is in progress.
4. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns. Typical sleep mode current is
200 nA.
5. Not 100% tested.
SRAM DC AND OPERATING CHARACTERISTICS
Parameter
Symbol
Parameter Description
Test Conditions
Min
Typ
Max Unit
ILI
Input Leakage Current
ILO
Output Leakage Current
ICC
Operating Power Supply Current
ICC1s Average Operating Current
ICC2s Average Operating Current
VOL
Output Low Voltage
VOH Output High Voltage
ISB
Standby Current (TTL)
ISB1
Standby Current (CMOS)
VIN = VSS to VCC
CE1#s = VIH, CE2s = VIL or OE# =
VIH or WE# = VIL, VIO= VSS to VCC
IIO = 0 mA, CE1#s = VIL, CE2s =
WE# = VIH, VIN = VIH or VIL
Cycle time = 1 µs, 100% duty,
IIO = 0 mA, CE1#s ≤ 0.2 V,
CE2 ≥ VCC – 0.2 V, VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
Cycle time = Min., IIO = 0 mA,
100% duty, CE1#s = VIL, CE2s =
VIH, VIN = VIL = or VIH
IOL = 2.1 mA
IOH = –1.0 mA
CE1#s = VIH, CE2 = VIL, Other
inputs = VIH or VIL
CE1#s ≥ VCC – 0.2 V, CE2 ≥ VCC –
0.2 V (CE1#s controlled) or CE2 ≤
0.2 V (CE2s controlled), CIOs =
VSS or VCC, Other input = 0 ~ VCC
–1.0
–1.0
2.4
1.0
µA
1.0
µA
3
mA
5
mA
40
mA
0.4
V
V
0.3
mA
25
µA
34
DS42585