CS3170 Datasheet, PDF (4/11 Pages) Applied Micro Circuits Corporation – 2.5 Gbps Transimpedance Amplifier

S3170 – 2.5 Gbps Transimpedance Amplifier
Figure 3. Bonding Pad Location
Revision A – August 12, 2004
Data Sheet
Y-Axis
1.27 mm (Total Die Size)
1.15 mm (Circuit Die Size)
VCC
VCC
VCC VCC
11
10
9
8
VCC
12
RBYPASS
13
IIN
14
RBYPASS
15
7
FILT
6
OUTN
5
OUTP
1
2
3
(0,0) Circuit Die Size¹
Total Die Size²
GND
GND
Pad Size is 94 µm x 94 µm. Area of exposed area is 80 µm x 80 µm.
Die Thickness is 254 µm (10 mils)
GND
4
GND
X-Axis
1. The circuit die size is the smallest possible size of the die. The lower left-hand corner of the circuit die is the
origin of the xy-coordinate system. Pad coordinates indicated in Table 1 are measured from this origin to the
pad's center.
2. The total die size is the largest possible size of the die. It includes a splicing area around the circuit die. The
actual size of any given die may vary in size from the minimum (circuit die) size to the maximum (total die)
size.
4
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