CS3170 Datasheet, PDF (3/11 Pages) Applied Micro Circuits Corporation – 2.5 Gbps Transimpedance Amplifier

S3170 – 2.5 Gbps Transimpedance Amplifier
Revision A – August 12, 2004
Data Sheet
Table 1. S3170 Pad Assignment and Description
Pin Name
I/O Pad #
Coordinates [X,Y] ⁽¹⁾
Description
VCC
8
9
S
10
11
12
[868.9, 1051.4]
[669.6, 1051.4]
[470.8, 1051.4]
[271.8, 1051.4]
[90.8, 892.5]
+3.3 V Power supply.
GND
1
S
2
3
4
[273, 91.4]
[472, 91.4]
[670.8, 91.4]
[870.1, 91.4]
Ground.
RBYPASS
I
13
15
[100.925, 702.425]
[90.9, 293.3]
Bypass connection for cathode of photodiode.
IIN
I
14
[97.575, 473.975]
PIN diode input.
FILT
I
7
[1052.3. 777]
Filter capacitor input. A capacitor to ground can be
added at this pad to reduce the low frequency -3 dB
cutoff. (See Design Procedures).
OUTN
O
6
[1049.275, 567.475] Negative transimpedance amplifier output.
OUTP
O
5
[1049.275, 375.225] Positive transimpedance amplifier output.
1. The coordinates represent the position of the center of the pad in µm, with respect to the lower left corner of the die.
2. Note: I = Input pin, O = Output pin, S = Supply pin
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