EP4CE6E22I7 Datasheet, PDF (5/14 Pages) Altera Corporation – 1. Cyclone IV FPGA Device Family Overview

Package Matrix
Table 1–3 lists Cyclone IV E device package offerings.
Table 1–3. Package Offerings for the Cyclone IV E Device Family ⁽¹⁾
Package
E144
M164
U256
Size (mm)
22 × 22
8×8
14 × 14
Pitch (mm)
0.5
0.5
0.8
F256
17 × 17
1.0
U484
19 × 19
0.8
F484
23 × 23
1.0
F780
29 × 29
1.0
Device
EP4CE6
91
21
—
—
179
66
179
66
—
—
—
—
—
—
EP4CE10
91
21
—
—
179
66
179
66
—
—
—
—
—
—
EP4CE15
81
18
89
21
165
53
165
53
—
—
343
137
—
—
EP4CE22
79
17
—
—
153
52
153
52
—
—
—
—
—
—
EP4CE30
—
—
—
—
—
—
—
—
—
—
328
124
532
224
EP4CE40
—
—
—
—
—
—
—
—
328
124
328
124
532
224
EP4CE55
—
—
—
—
—
—
—
—
324
132
324
132
374
160
EP4CE75
—
—
—
—
—
—
—
—
292
110
292
110
426
178
EP4CE115
—
—
—
—
—
—
—
—
—
—
280
103
528
230
Notes to Table 1–3:
(1) The E144 package has an exposed pad at the bottom of the package. This exposed pad is a ground pad that must be connected to the ground plane of your PCB. Use this exposed pad for electrical
connectivity and not for thermal purposes.
(2) This includes both dedicated and emulated LVDS pairs. For more information, refer to the I/O Features in Cyclone IV Devices chapter.