EP1K30TC144-2N Datasheet, PDF (27/182 Pages) Altera Corporation – Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices
27
Thermal Resistance
Table 28. Thermal Resistance of Stratix Devices (Part 2 of 2)
Device
EP1S30
EP1S40
EP1S60
EP1S80
Package
FBGA,
Flip Chip
BGA,
Flip Chip
FBGA,
Flip Chip
FBGA,
Flip Chip
BGA,
Flip Chip
FBGA,
Flip Chip
FBGA,
Flip Chip
BGA,
Flip Chip
FBGA,
Flip Chip
FBGA,
Flip Chip
BGA,
Flip Chip
FBGA,
Flip Chip
FBGA,
Flip Chip
Pin Count _JC (° C/W)
780
0.2
956
0.2
1020
0.2
780
0.2
956
0.2
1020
0.2
1508
0.2
956
0.1
1020
0.1
1508
0.1
956
0.1
1020
0.1
1508
0.1
_JA (° C/W)
Still Air
10.4
9.1
9.9
10.4
9.0
9.8
9.1
8.9
9.7
8.9
8.8
9.6
8.8
_JA (° C/W)
100 ft./min.
8.4
7.1
7.9
8.3
7.0
7.8
7.1
6.9
7.7
7.0
6.8
7.6
6.9
_JA (° C/W)
200 ft./min.
7.0
5.8
6.5
6.9
5.7
6.4
5.8
5.6
6.3
5.6
5.5
6.2
5.5
_JA (° C/W)
400 ft./min.
5.9
4.8
5.4
5.8
4.7
5.3
4.7
4.6
5.2
4.6
4.5
5.1
4.5
Cyclone Series Devices Thermal Resistance
Table 29 to Table 30 provide thermal resistance values for Cyclone series devices.
Cyclone II Devices
Table 29 lists the thermal resistance of Cyclone II devices.
Table 29. Thermal Resistance of Cyclone II Devices (Part 1 of 2)
Device
EP2C5
Package
TQFP,
Wire Bond
PQFP,
Wire Bond
FBGA,
Wire Bond
Pin Count
144
208
256
_JC (° C/W)
10.0
5.5
8.7
_JA (° C/W)
Still Air
31.0
30.4
30.2
_JA (° C/W)
100 ft./min.
29.3
_JA (° C/W)
200 ft./min.
27.9
_JA (° C/W)
400 ft./min.
25.5
29.2
27.3
22.3
26.1
23.6
21.7
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices