A4927 Datasheet, PDF (39/40 Pages) Allegro MicroSystems – Automotive Half-Bridge MOSFET Driver

A4927
Automotive Half-Bridge MOSFET Driver
PACKAGE OUTLINE DRAWING
For Reference Only – Not for Tooling Use
(Reference MO-153 ADT)
NOT TO SCALE
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
7.80 ±0.10
4.32 NOM
8º
0º
24
0.20
0.09
B
A
12
24X
0.10 C
0.30
0.19
0.65 BSC
0.45
0.65
3 NOM 4.40±0.10 6.40±0.20
C
1.20 MAX
SEATING
PLANE
0.15
0.00
0.60 ±0.15 ^{1.00 REF}
0.25 BSC
SEATING PLANE
GAUGE PLANE
1.65
A Terminal #1 mark area
B Exposed thermal pad (bottom surface); dimensions may vary with device
3.00 6.10
C Reference land pattern layout (reference IPC7351 TSOP65P640X120-25M);
all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances; when
mounting on a multilayer PCB, thermal vias at the exposed thermal pad land
can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5)
4.32
C PCB Layout Reference View
Figure 11: Package LP, 24-Lead TSSOP with Exposed Pad
Allegro MicroSystems, LLC
39
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com