ISL3158AE Datasheet, PDF (14/16 Pages) Intersil Corporation – ±16.5kV ESD (IEC61000-4-2) Protected, Large Output Swing, 5V, Full Fail-Safe, 1/8 Unit Load, RS-485/RS-422 Transceiver

Die Characteristics
DIE DIMENSIONS INCLUDING 50µM SCRIBE
Thickness: 19 mils
1400µm x 1530µm
Interface Materials
GLASSIVATION
Sandwich TEOS and Nitride
TOP METALLIZATION
Type: Al with 0.5% Cu
Thickness: 28kÅ
SUBSTRATE
N/A
BACKSIDE FINISH
Silicon/Polysilicon/Oxide
Assembly Related Information
SUBSTRATE POTENTIAL
GND (powered up)
Additional Information
WORST CASE CURRENT DENSITY
N/A
PROCESS
Si GateBiCMOS, IBM P6
TRANSISTOR COUNT
530
PAD OPENING SIZE:
90µm x 90µm
WAFER SIZE:
200mm (~8 inch)
ISL3158AE
TABLE 2. BOND PAD FUNCTION AND COORDINATES
PAD #
FUNCTION
X
(µm)
Y
(µm)
1
RO
99.5
1308
2
RE
99.5 1014.35
3
DE
99.5
498.3
4
DI
99.5 286.75
5
GND2
574.3 104.7
6
GND1
684.3 104.7
7
Y
1054
250.6
8
A (half duplex)
1054 540.45
9
Z
1054
831.1
10
B
1054 1004.65
11
A (full duplex)
1054 1256.45
12
V_CC
562.55 1385.35
14
FN6886.0
April 3, 2009