AK4186 Datasheet, PDF (31/33 Pages) Asahi Kasei Microsystems – Low Power Touch Screen Controller with I2C Interface

PACKAGE (AK4186EN)
[AK4186]
16pin QFN (Unit: mm)
Top View
A
B
1.50
3.00±0.07
Bottom View
1.80
9
12
8
13
Exposed
Pad
16
4
0.22±0.05
1
C0.30
0.05 M S A B
S
Part A
0.50
0.05 S
0.17~0.27
[Part A Detail]
Note: The thermal die pad must be open or connected to the ground.
■ Package & Lead frame material
Package molding compound: Epoxy Resin, Halogen (bromine and chlorine) free
Lead frame material: Cu Alloy
Lead frame surface treatment: Palladium Plate
MS1068-E-04
- 31 -
2011/03