AK7756 Datasheet, PDF (23/27 Pages) Asahi Kasei Microsystems – DSP with Mono CODEC + Mic/Lineout Amp

PACKAGE (AK7756EN)
28Pin QFN (Unit: mm)
3.10
5.0±0.07
15
14
A
[AK7756]
21
22
B
2.50
A
0.05 S
0.5
8
1 ²⁸
7
0.23±0.05
S
0.05 M S A B
[Detail A]
C0.30
0.18~0.28
Note: The exposed pad on the bottom surface of the package must be open or connected to the ground.
■ Package & Lead frame material
Package molding compound: Epoxy
Lead frame material: Cu
Lead frame surface treatment: Solder (Pb free) plate
MS1218-E-00-PB
23
2010/08