AMC76386 Datasheet, PDF (6/8 Pages) ADDtek Corp – Dual 450mA LDO REGULATOR

Application Note:
AMC76386
The maximum power dissipation of a single-output regulator:
P_D(MAX) = [(V_IN(MAX) - V_OUT(NOM))] × I_OUT(NOM) + V_IN(MAX) × I_Q
V_OUT(NOM) = the nominal output voltage
I_OUT(NOM) = the nominal output current, and
I_Q = the quiescent current the regulator consumes at I_OUT(MAX)
V_IN(MAX) = the maximum input voltage
Thermal consideration:
The AMC76386 series have internal power and thermal limiting circuitry designed to protect the device under overload
conditions. However maximum junction temperature ratings should not be exceeded under continuous normal load
conditions. The thermal protection circuit of AMC76386 series will prevent the device from damage due to excessive
power dissipation. When the device temperature rises to approximately 150 ^OC, the regulator will be turned off.
When power consumption is over about 487mW (SOP-8 package, at T_A=70 ^OC), additional heat sink is required to
control the junction temperature below 125 ^OC.
The junction temperature is: T_J = P_D (θ_JT + θ_CS + θ_SA ) + T_A
P _D: Total Dissipated power.
θ_JT:Thermal resistance from the junction to the mounting tab of the package.
θ_CS:Thermal resistance through the interface between the IC and the surface on which it is mounted.
(typically, θ_CS < 1.0 ^OC /W)
θ_SA:Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of
copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with
several through hole vias.
PCB θ_SA (^OC /W )
59
PCB heat sink size (mm²) 500
45
1000
38
1500
33
2000
27
3000
24
4000
21
5000
Recommended figure of PCB area used as a heat sink.
through hole vias
(Top View)
(Bottom View)
Copyright © 2006 ADDtek Corp.
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DD055_A -- JUNE 2006