ADR225HRZN Datasheet, PDF (9/12 Pages) Analog Devices – High Temperature, Low Drift, Micropower 2.5 V Reference

Data Sheet
ADR225
OUTLINE DIMENSIONS
0.053
0.050
0.047
0.155
0.150
0.145
0.006
0.005
0.004
5.00 (0.1968)
4.80 (0.1890)
8
4.00 (0.1574)
3.80 (0.1497) ¹
5
6.20 (0.2441)
4 ^{5.80 (0.2284)}
0.25 (0.0098)
0.10 (0.0040)
1.27 (0.0500)
BSC
1.75 (0.0688)
1.35 (0.0532)
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
0.50 (0.0196) _45°
0.25 (0.0099)
8°
0°
1.27 (0.0500)
0.25 (0.0098) _{0.40 (0.0157)}
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 18. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
1.00
0.260
0.255 SQ
0.250
0.195
0.190 SQ
0.185
1
8
4
5
0.012 R
TYP
TOP VIEW
END VIEW
0.175
0.019
0.017
0.015
0.091
0.083
0.075
0.026 MIN
IDEX
MARK
BOTTOM VIEW
0.024
SIDE VIEW
0.007
MIN
Figure 19. 8-Lead Ceramic Flat Package [FLATPACK]
(F-8-2)
Dimensions shown in inches
0.035
TYP
0.05 TYP
0.054
0.044
0.034
ORDERING GUIDE
Model¹
ADR225HRZN
ADR225HFZ
1 _{Z = RoHS Compliant Part.}
Temperature Range
−40°C to +175°C
−40°C to +210°C
Package Description
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Ceramic Flat Package [FLATPACK]
Package Option
R-8
F-8-2
Rev. A | Page 9 of 12