ADR225HRZN Datasheet, PDF (4/12 Pages) Analog Devices – High Temperature, Low Drift, Micropower 2.5 V Reference

ADR225
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage
OUTPUT to GND
Storage Temperature Range
Operating Temperature Range
8-Lead SOIC
8-Lead FLATPACK
Junction Temperature Range
8-Lead SOIC
8-Lead FLATPACK
Lead Temperature (Soldering 60 sec)
Rating
−0.3 V to +18 V
−0.3 V to VS + 0.3 V
−65°C to +150°C
−40°C to +175°C
−40°C to +210°C
−40°C to +200°C
−40°C to +245°C
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PREDICTED LIFETIME vs. OPERATING
TEMPERATURE
Comprehensive reliability testing is performed on the ADR225.
Product lifetimes at extended operating temperature are obtained
using high temperature operating life (HTOL). Lifetimes are
predicted from the Arrhenius equation, taking into account
potential design and manufacturing failure mechanism
assumptions. HTOL is performed to JEDEC JESD22-A108. A
minimum of three wafer fab and assembly lots are processed
through HTOL at the maximum operating temperature.
Comprehensive reliability testing is performed on all Analog
Devices, Inc., high temperature (HT) products.
Data Sheet
100k
10k
1k
100
10
1
120 130 140 150 160 170 180 190 200 210
OPERATING TEMPERATURE (°C)
Figure 2. Predicted Lifetime vs. Operating Temperature
THERMAL RESISTANCE
θJA is specified for worst-case conditions; that is, θJA is specified
for the device soldered in the circuit board.
Table 3.
Package Type
8-Lead SOIC
8-Lead FLATPACK
θJA
θJC
121
43
100
15
Unit
°C/W
°C/W
ESD CAUTION
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