OP467_15 Datasheet, PDF (6/20 Pages) Analog Devices – Quad Precision, High Speed Operational Amplifier

OP467
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter¹
Supply Voltage
Input Voltage²
Differential Input Voltage²
Output Short-Circuit Duration
Storage Temperature Range
14-Lead CERDIP and 20-Terminal LCC
14-Lead PDIP and 16-Lead SOIC
Operating Temperature Range
OP467A
OP467G
Junction Temperature Range
14-Lead CERDIP and 20-Terminal LCC
14-Lead PDIP and 16-Lead SOIC
Lead Temperature (Soldering, 60 sec)
Rating
±18 V
±18 V
±26 V
Limited
−65°C to +175°C
−65°C to +150°C
−55°C to +125°C
−40°C to +85°C
−65°C to +175°C
−65°C to +150°C
300°C
1 _{Absolute maximum ratings apply to both DICE and packaged parts, unless}
otherwise noted.
2 _{For supply voltages less than ±18 V, the absolute maximum input voltage is}
equal to the supply voltage.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5.
Package Type
14-Lead CERDIP (Y)
14-Lead PDIP (P)
16-Lead SOIC (S)
20-Terminal LCC (RC)
θJA1
θJC
Unit
94
10
°C/W
76
33
°C/W
88
23
°C/W
78
33
°C/W
1 _{θJA is specified for the worst-case conditions, that is, θJA is specified for device}
in socket for CERDIP, PDIP, and LCC packages, and θJA is specified for device
soldered in circuit board for the SOIC package.
DICE CHARACTERISTICS
–IN A 2
1 14
13 –IN D
+IN A 3
V+ 4
+IN B 5
12 +IN D
11 V–
10 +IN C
–IN B 6
78
9 –IN C
Figure 5. 0.111 Inch × 0.100 Inch DIE Size, 11,100 sq. mils,
Substrate Connected to V+, 165 Transistors
ESD CAUTION
Rev. * | Page 6 o f 20