HMC606LC5 Datasheet, PDF (6/6 Pages) Hittite Microwave Corporation – GaAs InGaP HBT MMIC ULTRA LOW PHASE NOISE, DISTRIBUTED AMPLIFIER, 2 - 18 GHz

Evaluation PCB
HMC606LC5
v05.0514
GaAs InGaP HBT MMIC ULTRA LOW
PHASE NOISE, DISTRIBUTED AMPLIFIER, 2 - 18 GHz
List of Materials for Evaluation PCB 117156 ^[1]
Item
Description
J1 - J2
SRI K Connector
J3 - J4
2mm Molex Header
C1, C2
4.7 µF Capacitor, Tantalum
C3, C4
100 pF Capacitor, 0402 Pkg.
C5, C6
1000 pF Capacitor, 0603 Pkg.
U1
PCB ^[2]
HMC606LC5
117325 Evaluation PCB
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
The circuit board used in the application should use
RF circuit design techniques. Signal lines should
have 50 Ohm impedance while the package ground
leads and package bottom should be connected
directly to the ground plane similar to that shown.
A sufficient number of via holes should be used
to connect the top and bottom ground planes.
The evaluation board should be mounted to an
appropriate heat sink. The evaluation circuit board
shown is available from Hittite upon request.
Irrliniecg_Ffseohpn_{otrsomsrenoasftpiisibtohringilriirtdcyafunpie}rstnae_{,airdstsihdesbesuye}dmthi_{lmebaivdtypmelbiAcPyaranyyAhtaiorlnooenaagslnuoonlDrgetd}eofD_:rvtoheitm9cev_oeri_{7cwistesp8issiuse-lfsao2}beur_{c.ne5idtSlies0}eepvure_-es_oca3dein_rf,iy3cdtnoaop_{4etriabo3rftenoessrna:tascnouH}cyrbu_Fjipierntaa_{acftrttteieixnttnoge:}atecnr_{9mhdiMga7ehnrnte8igstc}lsei_-ao_ro2bwf_{oflAie5ptwhn.a0oatHuealo-tongv3}wntso_eDe3otviecr7e_Cveori3,.cth_{oeNnesoorr.poOFOProarhndroteinepoTerreni:ccO7,eh82,nn1od--E3lleoil2lngii9vzeye-a4rWaby7,at0eya0wt,nh•Pdw.ODOwtor.rdi.Bvephoreliaxto,ctn9ieCtl1ein0ho.e6rced,aoleNmtmrwoss:rwwfAowonro.adadln,o,agMMloADgAe.0cv02oic01me68s22,-94In10c.6,}
6
Trademarks and registered trademarks a_Are_pth_pe_lp_ir_cop_ae_tr_ity_oo_nf th_Sei_ur r_pes_ppe_oct_riv_te_: o_Pw_hne_ors_n. _{e: 978-250-33}A₄p₃plic_oa_rtio_an_pS_pu_sp_@po_hrt_i:_tP_tih_teo_.n_ce_o: 1_m-800-ANALOG-D