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HMC447LC3 Datasheet, PDF (6/8 Pages) Hittite Microwave Corporation – SMT GaAs HBT MMIC DIVIDE-BY-4, 10 - 26 GHz
v04.0514
Evaluation PCB
HMC447LC3
SMT GaAs HBT MMIC
DIVIDE-BY-4, 10 - 26 GHz
List of Materials for Evaluation PCB 107928 [1]
Item
J1
J2
J3, J4
C1
C2, C3
C4
C5
U1
Description
PCB Mount SRI K-Connector
PCB Mount SMA RF Connector
DC Pin
10pF Capacitor, 0402 Pkg.
100 pF Capacitor, 0402 Pkg.
10000 pF Capacitor, 0603 Pkg.
2.2 uF Tantalum Capacitor
HMC447LC3 Divide-by-4
The circuit board used in the final application sho-
uld use RF circuit design techniques. Signal lines
should have 50 Ohm impedance while the package
ground leads and backside ground paddle should
be connected directly to the ground plane similar
to that shown. A sufficient number of via holes
should be used to connect the top and bottom
ground planes. The evaluation circuit board shown
is available from Hittite upon request.
PCB [2]
107926 Eval Board
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
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