HMC447LC3 Datasheet, PDF (4/8 Pages) Hittite Microwave Corporation – SMT GaAs HBT MMIC DIVIDE-BY-4, 10 - 26 GHz

v04.0514
Outline Drawing
HMC447LC3
SMT GaAs HBT MMIC
DIVIDE-BY-4, 10 - 26 GHz
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA
2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES
GOLD OVER 50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS]
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C- .
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
Package Information
Part Number
Package Body Material
HMC447LC3
Alumina, White
[1] Max peak reflow temperature of 260 °C
[2] 4-Digit lot number XXXX
Lead Finish
Gold over Nickel
MSL Rating
MSL3 ^[1]
Package Marking ^[2]
H447
XXXX
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