OP400_07 Datasheet, PDF (5/16 Pages) Analog Devices – Quad Low Offset, Low Power Operational Amplifier

ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Differential Input Voltage
Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
P, Y Packages
Lead Temperature (Soldering 60 sec)
Junction Temperature (TJ) Range
Operating Temperature Range
OP400A
OP400E, OP400F
OP400G
OP400H
Rating
±20 V
±30 V
Supply voltage
Continuous
−65°C to +150°C
300°C
−65°C to +150°C
−55°C to +125°C
−25°C to +85°C
0°C to 70°C
−40°C to +85°C
ESD CAUTION
OP400
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply to both dice and packaged
parts, unless otherwise noted.
THERMAL RESISTANCE
θJA is specified for worst-case mounting conditions, that is, θJA is
specified for device in socket for CERDIP and PDIP packages;
θJA is specified for device soldered to printed circuit board for
SOIC package.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
14-Pin Ceramic DIP (Y)
94
10 °C/W
14-Pin Plastic DIP (P)
76
33 °C/W
16-Pin SOIC (S)
88
23 °C/W
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