DAC8412 Datasheet, PDF (5/14 Pages) Analog Devices – Quad, 12-Bit DAC Voltage Output with Readback

DAC8412/DAC8413
ABSOLUTE MAXIMUM RATINGS
(T_A = +25°C unless otherwise noted)
V_SS to V_DD . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +33.0 V
V_SS to V_LOGIC . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +33.0 V
V_LOGIC to DGND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7.0 V
V_SS to V_REFL . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +V_SS–2.0 V
V_REFH to V_DD . . . . . . . . . . . . . . . . . . . . . . . . . +2.0 V, +33.0 V
V_REFH to V_REFL . . . . . . . . . . . . . . . . . . . . . . . . +2.0 V, V_SS–V_DD
Current into Any Pin 4 . . . . . . . . . . . . . . . . . . . . . . . . ± 15 mA
Digital Input Voltage to DGND . . . . . –0.3 V, V_LOGIC +0.3 V
Digital Output Voltage to DGND . . . . . . . . . . –0.3 V, +7.0 V
Operating Temperature Range
ET, FT, EP, FP, FPC . . . . . . . . . . . . . . . . –40°C to +85°C
AT, BT, BTC . . . . . . . . . . . . . . . . . . . . . –55°C to +125°C
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Power Dissipation Package . . . . . . . . . . . . . . . . . . . 1000 mW
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
Thermal Resistance
Package Type
␪_JA* ␪_JC Units
28-Lead Plastic DIP (P)
48 22 °C/W
28-Lead Hermetic Leadless Chip Carrier (TC) 70 28 °C/W
28-Lead Plastic Leaded Chip Carrier (PC) 63 25 °C/W
*θ_JA is specified for worst-case mounting conditions, i. e., θ_JA is specified for device
in socket.
ORDERING INFORMATION^{1, 2}
INL
(LSB)
±1
± 1.5
0.5
±1
±1
± 1.5
± 0.5
±1
Military³ Temperature
–55؇C to +125؇C
DAC8412BTC/883
DAC8413BTC/883
Extended Industrial³ Temperature
–40؇C to +85؇C
DAC8412FPC
DAC8412EP
DAC8412FP
DAC8413FPC
DAC8413EP
DAC8413FP
Package
Description
PLCC
LCC
Plastic DIP
Plastic DIP
PLCC
LCC
Plastic DIP
Plastic DIP
Package
Option
P-28A
E-28A
N-28
N-28
P-28A
E-28A
N-28
N-28
NOTES
1_{Die Size 0.225 × 0.165 inches, 37,125 sq. mils (5.715 × 4.191 mm, 23.95 sq. mm). Substrate should be connected to VDD; Transistor Count = 2595.}
2_{Burn-in is available on extended industrial temperature range parts in cerdip.}
3_{A complete /883 data sheet is available. For availability and burn-in information, contact your local sales office.}
CAUTION
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the
device. This is a stress rating only; functional operation at or above this specification is not implied.
Exposure to the above maximum rating conditions for extended periods may affect
device reliability.
2. Digital inputs and outputs are protected, however, permanent damage may occur on unprotected units
from high-energy electrostatic fields. Keep units in conductive foam or packaging at all times until
ready to use. Use proper antistatic handling procedures.
3. Remove power before inserting or removing units from their sockets.
4. Analog outputs are protected from short circuit to ground or either supply.
WARNING!
ESD SENSITIVE DEVICE
REV. D
–5–