ADSP-21363 Datasheet, PDF (43/44 Pages) Analog Devices – SHARC Processor

Preliminary Technical Data
PACKAGE DIMENSIONS
The ADSP-21363 is available in a 136-ball Mini-BGA package
and a 144-lead integrated heatsink LQFP package.
ADSP-21363
0.27
0.22 TYP
0.17
SEATING
P LANE
0.08 MAX (LEAD
COPLANARITY)
0.15
0.05
0 .50
BSC
TYP
(LEAD
PI TCH)
22.00 BSC SQ
20. 00 BSC SQ
144
1
PIN 1 INDICA TOR
10 9
108
13 .71
13.21 DIA
12 .71
0 .7 5
0.60 TYP
0 .4 5
1. 45
1. 40
1. 35
1.60 MAX
DE TAIL A
36
37
DETAIL A
NOTES :
1. DIMENSIONS ARE IN MILLIMETERS AND COMPLY WITH
JEDEC STANDARD MS-026-BFB-HD.
2. ACTUAL PO SITION OF EACH LEAD IS WITHIN 0.08 OF ITS
IDEAL POSITION, WHEN MEASURED IN THE LATERAL DIRECTI ON.
3. CENTER DIMENSIONS ARE NOMINAL.
4. HEATSLUG IS COINCIDENT WI TH BO TTOM SURFACE AND DOES
NOT PROTRUDE BEYOND IT.
72
HEATSLUG ON BOTTOM
(NOTE 4)
TOP VIE W (P INS DO WN)
Figure 35. 144-Lead Integrated Heatsink LQFP (SQ-144-3)
Rev. PrA | Page 43 of 44 | September 2004