OP295 Datasheet, PDF (4/12 Pages) Analog Devices – DUAL/QUAD RAIL-TO-RAIL OPERATIONAL AMPLIFIERS

OP295/OP495
ABSOLUTE MAXIMUM RATINGS¹
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .± 18 V
Input Voltage² . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .± 18 V
Differential Input Voltage². . . . . . . . . . . . . . . . . . . . . . . +36 V
Output Short-Circuit Duration . . . . . . . . . . . . . . . . . Indefinite
Storage Temperature Range
P, S Package . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range
OP295G, OP495G . . . . . . . . . . . . . . . . . . . –40°C to +125°C
Junction Temperature Range
P, S Package . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering, 60 Sec) . . . . . . . +300°C
Package Type
␪_JA3
␪_JC
Unit
8-Pin Plastic DIP (P)
103
43
8-Pin SOIC (S)
158
43
14-Pin Plastic DIP (P)
83
39
16-Pin SO (S)
98
30
°C/W
°C/W
°C/W
°C/W
NOTES
1_{Absolute maximum ratings apply to both DICE and packaged parts, unless}
otherwise noted.
2_{For supply voltages less than ± 18 V, the absolute maximum input voltage is equal}
to the supply voltage.
3_{θJA is specified for the worst case conditions, i.e., θJA is specified for device in socket}
for cerdip, P-DIP, and LCC packages; θ_JA is specified for device soldered in circuit
board for SOIC package.
DICE CHARACTERISTICS
OP295 Die Size 0.066 × 0.080 inch, 5,280 sq. mils.
Substrate (Die Backside) Is Connected to V+.
Transistor Count, 74.
Typical Characteristics
140
120
100
V_S = +36V
V_S = +5V
80
V_S = +3V
60
40
20
–50
–25
0
25
50
TEMPERATURE – °C
75
100
Supply Current Per Amplifier vs. Temperature
OP495 Die Size 0.113 × 0.083 inch, 9,380 sq. mils.
Substrate (Die Backside) Is Connected to V+.
Transistor Count, 196.
15.2
V_S = ±15V
R_L = 100k
15.0
14.8
R_L = 10k
14.6
14.4
R_L = 2k
14.2
–14.4
–14.6
–14.8
–15.0
–15.2
–50
–25
0
25
50
TEMPERATURE – °C
R_L = 2k
R_L = 10k
R_L = 100k
75
100
Output Voltage Swing vs. Temperature
–4–
REV. B