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OP295 Datasheet, PDF (3/12 Pages) Analog Devices – DUAL/QUAD RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
ELECTRICAL CHARACTERISTICS (@ VS = ±15.0 V, TA = +25؇C unless otherwise noted)
OP295/OP495
Parameter
Symbol
Conditions
Min
Typ Max
Units
INPUT CHARACTERISTICS
Offset Voltage
Input Bias Current
Input Offset Current
Input Voltage Range
Common-Mode Rejection Ratio
Large Signal Voltage Gain
Offset Voltage Drift
OUTPUT CHARACTERISTICS
Output Voltage Swing High
Output Voltage Swing Low
Output Current
VOS
IB
IOS
VCM
CMRR
AVO
∆VOS/∆T
VOH
VOL
IOUT
–40°C ≤ TA ≤ +125°C
VCM = 0 V
VCM = 0 V, –40°C ≤ TA ≤ +125°C
VCM = 0 V
VCM = 0 V, –40°C ≤ TA ≤ +125°C
–15.0 V ≤ VCM ≤ +13.5 V, –40°C ≤ TA ≤ +125°C
RL = 10 kΩ
–15
90
1000
RL = 100 kΩ to GND
RL = 10 kΩ to GND
RL = 100 kΩ to GND
RL = 10 kΩ to GND
14.95
14.80
± 15
30
7
±1
110
4000
1
300
800
20
30
±3
±5
+13.5
–14.95
–14.85
± 25
µV
µV
nA
nA
nA
nA
V
dB
V/mV
µV/°C
V
V
V
V
mA
POWER SUPPLY
Power Supply Rejection Ratio
Supply Current
Supply Voltage Range
PSRR
ISY
VS
VS = ± 1.5 V to ± 15 V
VS = ± 1.5 V to ± 15 V, –40°C ≤ TA ≤ +125°C
VO = 0 V, RL = ∞, VS = ± 18 V,
–40°C ≤ TA ≤ +125°C
90
110
85
+3 (± 1.5)
dB
dB
175
µA
+36 (± 18) V
DYNAMIC PERFORMANCE
Slew Rate
Gain Bandwidth Product
Phase Margin
SR
GBP
θO
RL = 10 kΩ
0.03
V/µs
85
kHz
83
Degrees
NOISE PERFORMANCE
Voltage Noise
Voltage Noise Density
Current Noise Density
en p-p
en
in
0.1 Hz to 10 Hz
f =1 kHz
f = 1 kHz
1.25
µV p-p
45
nV/√Hz
<0.1
pA/√Hz
Specifications subject to change without notice.
WAFER TEST LIMITS (@ VS = +5.0 V, VCM = 2.5 V, TA = +25؇C unless otherwise noted)
Parameter
Symbol
Conditions
Limit
Units
Offset Voltage
Input Bias Current
Input Offset Current
Input Voltage Range1
Common-Mode Rejection Ratio
Power Supply Rejection Ratio
Large Signal Voltage Gain
Output Voltage Swing High
Supply Current Per Amplifier
Vos
IB
IOS
VCM
CMRR
PSRR
AVO
VOH
ISY
0 V ≤ VCM ≤ 4 V
± 1.5 V ≤ VS ≤ ± 15 V
RL = 10 kΩ
RL = 10 kΩ
VOUT = 2.5 V, RL = ∞
300
20
±2
0 to +4
90
90
1000
4.9
150
µV max
nA max
nA max
V min
dB min
µV/V
V/mV min
V min
µA max
NOTES
Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard
product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
1Guaranteed by CMRR test.
ORDERING GUIDE
Model
Temperature
Range
Package
Description
Package
Option
Model
Temperature
Range
Package
Description
Package
Option
OP295GP –40°C to +125°C 8-Pin Plastic DIP N-8
OP295GS –40°C to +125°C 8-Pin SOIC
SO-8
OP295GBC +25°C
DICE
OP495GP –40°C to +125°C 14-Pin Plastic DIP N-14
OP495GS –40°C to +125°C 16-Pin SOL
R-16
OP495GBC +25°C
DICE
REV. B
–3–