HMC558A Datasheet, PDF (4/15 Pages) Analog Devices – Conversion loss: 7.5 dB typical at 5.5 GHz to 10 GHz

HMC558A
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
RF Input Power
LO Input Power
IF Input Power
IF Source/Sink Current
Maximum Junction Temperature
Continuous PDISS (T = 85°C) (Derate
5.5 mW/°C Above 85°C)
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering 60 sec)
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device Model
(FICDM)
Rating
25 dBm
25 dBm
25 dBm
3 mA
175°C
495 mW
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
2500 V (Class 2)
1000 V (Class C5)
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Data Sheet
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 3. Thermal Resistance
Package Type
θJC
E-12-1¹
180
Unit
°C/W
1 _{See JEDEC standard JESD51-2 for additional information on optimizing the}
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
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