HMC558A Datasheet, PDF (15/15 Pages) Analog Devices – Conversion loss: 7.5 dB typical at 5.5 GHz to 10 GHz

Data Sheet
HMC558A
OUTLINE DIMENSIONS
PIN 1
INDICATOR
3.13
3.00 SQ
2.87
0.92 MAX
SEATING
PLANE
TOP VIEW
SIDE VIEW
0.50
BSC
0.36
0.30
0.24
10
12
9
1
EXPOSED
PAD
3
7
PIN 1
(0.32 × 0.32)
1.60
1.50 SQ
1.40
6
4
BOTTOM VIEW
1.00 REF
2.10 BSC
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
ORDERING GUIDE
Model¹
Temperature
Range
HMC558ALC3B
−40°C to +85°C
HMC558ALC3BTR
−40°C to +85°C
HMC558ALC3BTR-R5 −40°C to +85°C
EV1HMC558ALC3B
Figure 36. 12-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-12-1)
Dimensions shown in millimeters
Description
12-Terminal Ceramic
Leadless Chip Carrier [LCC]
12-Terminal Ceramic
Leadless Chip Carrier [LCC]
12-Terminal Ceramic
Leadless Chip Carrier [LCC]
Evaluation PCB Assembly
Package
Option
E-12-1
E-12-1
E-12-1
Package Body
Material
Alumina
Ceramic
Alumina
Ceramic
Alumina
Ceramic
1 _{Z = RoHS Compliant Part.}
Lead
Finish
Gold over
Nickel
Gold over
Nickel
Gold over
Nickel
MSL
Rating
MSL3
MSL3
MSL3
Branding
H558A
XXXX
H558A
XXXX
H558A
XXXX
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