HMC520A Datasheet, PDF (4/28 Pages) Analog Devices – Radio frequency (RF) range: 6 GHz to 10 GHz

HMC520A
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
RF Input Power
LO Input Power
IF1 and IF2 Input Power
IF DC Current
Maximum Peak Reflow Temperature¹
Continuous Power Dissipation, PDISS (TA = 85°C,
Derate 4.44 mW/°C Above 85°C)
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering 60 sec)
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device Model (FICDM)
Rating
20 dBm
27 dBm
20 dBm
12 mA
260°C
400 mW
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
750 V (Class 1B)
1250 V (Class C3)
1 _{See the Ordering Guide section.}
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Data Sheet
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 3. Thermal Resistance
Package Type
θJA
θJC1
E-24-1²
175°C 225
Unit
°C/W
1 _{θJC is the thermal resistance, junction to case (°C/W).}
2 _{See JEDEC standard JESD51-2 for additional information on optimizing the}
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
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