AD8331_06 Datasheet, PDF (39/40 Pages) Analog Devices – Ultralow Noise VGAs with Preamplifier and Programmable RIN

OUTLINE DIMENSIONS
9.80
9.70
9.60
28
1
PIN 1
0.15
0.05
COPLANARITY
0.10
0.65
BSC
0.30
0.19
15
4.50
4.40
4.30
6.40 BSC
14
1.20 MAX
8°
0.75
0.20
SEATING
PLANE
0.09
0°
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AE
Figure 95. 28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-28)
Dimensions shown in millimeters
AD8331/AD8332/AD8334
20
1
PIN 1
0.345
0.341
0.337
11
0.158
0.154
0.150 0.244
10
0.236
0.228
0.065
0.049
0.069
0.053
0.010
0.004
COPLANARITY
0.004
0.025
BSC
0.012
0.008
8°
SEATING
PLANE
0.010
0.006
0°
COMPLIANT TO JEDEC STANDARDS MO-137-AD
Figure 96. 20-Lead Shrink Small Outline Package [QSOP]
(RQ-20)
Dimensions shown in Inches
0.050
0.016
PIN 1
INDICATOR
5.00
BSC SQ
TOP
VIEW
4.75
BSC SQ
0.60 MAX
0.50
BSC
0.50
0.40
0.30
0.60 MAX
25
24
32
1
EXPOSED
PAD
(BOTTOM VIEW)
17
16
98
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.80 MAX
0.65 TYP
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
3.50 REF
PIN 1
INDICATOR
3.25
3.10 SQ
2.95
0.25 MIN
THE EXPOSE PAD IS NOT CONNECTED
INTERNALLY. FOR INCREASED RELIABILITY
OF THE SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE GROUND PLANE.
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 97. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
Rev. E | Page 39 of 40