ADXL343 Datasheet, PDF (34/36 Pages) Analog Devices – 3-Axis, ±2 g/±4 g/±8 g/±16 g

ADXL343
Preliminary Technical Data
LAYOUT AND DESIGN RECOMMENDATIONS
Figure 49 shows the recommended printed wiring board land pattern. Figure 50 and Table 24 provide details about the recommended
soldering profile.
3.3400
1.0500
0.5500
3.0500
5.3400
0.2500
0.2500
1.1450
Figure 49. Recommended Printed Wiring Board Land Pattern (Dimensions shown in millimeters)
T_P
T_L
T_SMAX
T_SMIN
t_P
RAMP-UP
CRITICAL ZONE
T_L TO T_P
t_L
t_S
PREHEAT
RAMP-DOWN
t25°C TO PEAK
TIME
Figure 50. Recommended Soldering Profile
Table 24. Recommended Soldering Profile^{1, 2}
Profile Feature
Average Ramp Rate from Liquid Temperature (T_L) to Peak Temperature (T_P)
Preheat
Minimum Temperature (T_SMIN)
Maximum Temperature (T_SMAX)
Time from T_SMIN to T_SMAX (t_S)
T_SMAX to T_L Ramp-Up Rate
Liquid Temperature (T_L)
Time Maintained Above T_L (t_L)
Peak Temperature (T_P)
Time of Actual T_P − 5°C (t_P)
Ramp-Down Rate
Time 25°C to Peak Temperature
Sn63/Pb37
3°C/sec maximum
Condition
Pb-Free
3°C/sec maximum
100°C
150°C
60 sec to 120 sec
3°C/sec maximum
183°C
60 sec to 150 sec
240 + 0/−5°C
10 sec to 30 sec
6°C/sec maximum
6 minutes maximum
150°C
200°C
60 sec to 180 sec
3°C/sec maximum
217°C
60 sec to 150 sec
260 + 0/−5°C
20 sec to 40 sec
6°C/sec maximum
8 minutes maximum
1 _{Based on JEDEC Standard J-STD-020D.1.}
2 _{For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used.}
Rev. PrA | Page 34 of 36